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Ultrasonic Cutting Machine Product List and Ranking from 5 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Ultrasonic Cutting Machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  2. コスモシステム Tokyo//Industrial Machinery
  3. スターテクノ Aichi//Industrial Machinery
  4. 4 日精 本社 Tokyo//Machine elements and parts
  5. 5 オカダ Ishikawa//Food Machinery
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Ultrasonic Cutting Machine Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Ultrasonic cutting device for cross-sectional observation 'CSX-100Lab' JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  2. Plastic Automatic Ultrasonic Cutting Device コスモシステム
  3. Star Techno | Are you efficiently processing various industrial sheets by cutting? スターテクノ
  4. Takeda Industrial's ultrasonic cutting device 'CSX-400 Series' JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 4 Takeda Industrial's ultrasonic cutting device 'CSX501' JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室

Ultrasonic Cutting Machine Product List

1～9 item / All 9 items

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Plastic Automatic Ultrasonic Cutting Device

Plastic Automatic Ultrasonic Cutting Device

Ultrasonic automatic cutting device ideal for cutting plastic gate cuts and burr removal, as well as cutting non-woven fabrics and films.

A cutting device that significantly enhances the cutting operation by fixing a dedicated blade to an ultrasonic vibrating body that vibrates 20,000 to 40,000 times per second and causes the blade to vibrate finely. 【Features】 - By applying the ultrasonic vibrating blade to plastic, the resin heats up at the molecular level, allowing for smooth melting and cutting. - The finely vibrating blade of the ultrasonic cutter reduces the cutting load, enabling precise cutting of hard resins, films, and soft materials or rubber products without distorting their shape and without the workpiece sticking to the blade. - Ultrasonic frequency types of 20 kHz and 40 kHz. - Workpiece rotating cutting mechanism. - Two-axis servo drive control. - Cutting accuracy of ±0.1 mm. - Automatic suction mechanism for cutting debris. - Touch screen operation panel. *For more details, please contact us.

  • Plastic processing machines (cutting and rolling)

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Ultrasonic Cutting Machine 'MC-2020T/MC-2020CRR'

Ultrasonic Cutting Machine 'MC-2020T/MC-2020CRR'

With the specified cutting dimensions, square cakes can be cut into various sizes! The blade can also be cleaned automatically.

The "MC-2020T/MC-2020CRR" is an ultrasonic cutting machine that can cut square, round, and roll cakes with simple operation using just one machine. By utilizing ultrasonic vibrations at a rate of 20,000 times per second to cut the cake, it produces clean cross-sections. Additionally, it can automatically clean the blade (MC-2020CRR). Furthermore, the ultrasonic blade minimizes friction between the food materials and the cutting machine, enhancing productivity and enabling fast, efficient, and effective cutting. 【Features】 ■ Can cut square, round, and roll cakes with simple operation using just one machine ■ Capable of cutting round cakes in various sizes (6, 8, 10, 12 cuts) ■ Can cut square cakes into various sizes by specifying cutting dimensions ■ Utilizes ultrasonic vibrations at a rate of 20,000 times per second to cut cakes, resulting in clean cross-sections *For more details, please refer to the PDF document or feel free to contact us.

  • Food Cutting Equipment

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Takeda Industrial's ultrasonic cutting device 'CSX501'

Takeda Industrial's ultrasonic cutting device 'CSX501'

Equipped with fully automatic and enhanced device functions, as well as remote monitoring capabilities! Contributing to increased productivity in the dicing process!

The "CSX501" is an ultrasonic cutting device equipped with a dual-end support mechanism that enables high-speed cutting, enhancing productivity and adding new functionalities. With the addition of equipment monitoring capabilities, it is now possible to recover from unexpected troubles with minimal equipment downtime through remote support. ■Features - Achieves high-speed, high-quality cutting of a wide range of materials, from difficult-to-cut materials like SiC, alumina, and PZT to composites such as glass and resin! - By adding ultrasound to blade cutting, it significantly reduces blade wear! - The development of a unique spindle and special ultrasonic blade that maximizes ultrasonic effects enables mass production-level cutting of SiC wafers at an 80µm street! *Demo units are available for sample evaluation. *We can also propose the semi-auto type "CSX-400." *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment

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Ultrasonic cutting device "Manufactured by Takada Kogyo Co., Ltd."

Ultrasonic cutting device "Manufactured by Takada Kogyo Co., Ltd."

Dicing device "CSX-400 series" that efficiently cuts difficult materials such as brittle materials and composites by adding ultrasonic vibrations.

The CSX-400 series is a dicing device that incorporates ultrasound to fragment wafers and integrated substrates into chips and individual substrates. By hybridizing ultrasound at the tip of the rotating blade, it achieves the ability to "hit with ultrasound and pull with rotation," not just relying on the "pulling action from rotational force" typical of conventional dicing processes. This technology generates many advantages not found in standard dicing methods. Additionally, we have prepared a demo environment for you to try out this ultrasound-enhanced cutting method, especially if you are facing challenges such as "lack of cutting methods" in the development of next-generation products. Please feel free to contact us.

  • CSX-401.jpg
  • Wafer processing/polishing equipment

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Mass production ultrasonic dicing equipment: Ultrasonic cutting device CSX501

Mass production ultrasonic dicing equipment: Ultrasonic cutting device CSX501

Ultrasonic assisted spindle equipped with a dual-end support mechanism that enables high-speed, high-precision cutting, improving productivity and quality - Ultrasonic dicing device!!

The mass production ultrasonic dicing device "CSX501" is a dicing machine that cuts difficult materials such as SiC, GaN, and fine ceramics with high speed and precision. The ultrasonic-assisted cutting with "CSX501" adds ultrasonic assistance to the "force generated by the rotation of the blade," allowing the blade to "vibrate in the outward direction" while cutting. This technology enables the achievement of improved throughput, reduced running costs, and increased yield while maintaining high-quality cutting. Furthermore, the addition of device monitoring functions allows for remote support, contributing to a reduction in recovery time from unexpected troubles. Additionally, by equipping various optional functions, it also contributes to the control of blade edge shapes and the reduction of cutting burrs. *We also conduct evaluations by cutting sample work upon request, so please feel free to contact us. *For more details, please refer to the PDF materials.

  • Ultrasonic Oscillator
  • Other cutting tools
  • Other processing machines

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Star Techno | Are you efficiently processing various industrial sheets by cutting?

Star Techno | Are you efficiently processing various industrial sheets by cutting?

The "XY Table Cutter" suitable for multi-variety, small-lot production cuts materials like resin and carbon using ultrasonic cutting! *Sample cutting available.

As diverse needs continue to expand, there has been a growing demand for cutting processes using different types of material sheets, as well as the need to cut sheets of varying thicknesses and hardness, leading to an increase in multi-variety production. Do you have any of these concerns? ■ Changing molds for punching processes is cumbersome ■ Want to cut plastics, carbon (CFRP), rubber, leather, etc., with a single machine ■ Want to improve yield ■ Want to cut composite materials! And more... Star Tech's ultrasonic cutting machine, the 'X-Y Table Cutter,' can smoothly cut hard materials that were previously impossible to cut with its high-output 500W ultrasonic power. Additionally, it generates almost no cutting debris, allowing for clean cutting of materials. ★ For more details, please check our catalog or product list on our website. ★ We can also accommodate sample cuts at our factory. Please feel free to contact us.

  • cutter

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Takeda Industrial's ultrasonic cutting device 'CSX-400 Series'

Takeda Industrial's ultrasonic cutting device 'CSX-400 Series'

Achieving high-quality and high-efficiency cutting of various materials, from difficult-to-cut materials like SiC and LTCC to composite materials such as glass and resin!

The "CSX-400 Series" is an ultrasonic cutting device that cuts a wide range of materials, including difficult-to-cut materials and composites such as SiC, LTCC, glass, and resin, with high quality, achieving high productivity and cost performance through improved blade life. ■ Features - Achieves high-quality and quick cutting thanks to ultrasonic effects! - Easy operation for anyone with a user-friendly interface! - Various cutting methods available, including pitch-cut and staggered-cut! - Reduced processing time with auto-alignment! (60% reduction compared to Takada Industrial) - Reduced daily maintenance time with a large front door! - Options for semi-auto (CSX-400) and full-auto (CSX-401)! - Standard equipped with a cleaning unit (CSX-401)! * For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment

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Ultrasonic cutting device for cross-sectional observation 'CSX-100Lab'

Ultrasonic cutting device for cross-sectional observation 'CSX-100Lab'

By performing "cutting" and "polishing" in one process, we achieve a significant reduction in cross-section cutting work time and high-quality cuts! It can be easily operated by anyone without any skills!

The Takeda Industrial's 'CSX-100Lab' is an automatic cutting device specifically designed for the preparation of cross-sectional observation samples. It significantly reduces the time required to prepare cross-sectional observation samples for both development and mass production, achieving improved operational efficiency and high-quality sample cross-sections! ■ Features - The cutting surface has a beautiful mirror finish due to ultrasonic effects. - Capable of cutting composite materials with varying hardness, including solder and ceramics. - The blade extension can be up to 10mm, accommodating thick samples. - Even beginners can obtain cross-sectional samples for observation without any skill. - After setting the cutting conditions, it operates automatically, allowing for effective use of time. - When combined with the skeleton cut (optional), it can target and cut inside molded electronic components. - There are many successful implementations as a preprocessing device (reducing milling time) such as ion milling. * A demo unit is available, so sample evaluation is possible. * For more details, please refer to the PDF document or feel free to contact us.

  • 断面観察用超音波カッティング装置CSX-100Lab 切断面サンプル.jpg
  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment

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Ultrasonic cutting device for sample preparation for cross-section and SEM observation.

Ultrasonic cutting device for sample preparation for cross-section and SEM observation.

No resin embedding! Achieving efficiency in cross-section sample preparation without the need for skills. Contributing to the efficiency of SEM observation. 'Ultrasonic Cutting Device CSX-100Lab'

The cross-section sample preparation device "CSX-100Lab" is a specialized device that utilizes the cutting surface polishing effect (PolishCut) of our uniquely developed "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing." It is ideal for improving the efficiency of cross-sectional observation, failure analysis, defect analysis, structural analysis, and verification of manufacturing conditions. Features include: 1) clean cross-sections, 2) precise cutting at targeted positions, 3) cutting of invisible objects by overlaying drawings or X-ray images with monitor images (skeleton cut option), 4) skill-free cross-section sample preparation, 5) reduction of milling time when used as a pre-treatment device for ion milling during SEM observation, and 6) cross-sectional observation of small chip components like 0402. It is particularly used in situations where many cross-section samples are prepared. We also have a demo environment where you can evaluate the actual cutting of your samples, so please feel free to contact us!

  • Analytical Equipment and Devices

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